alterelektroniker

You are right about that! Don't do that. This said, loooong time ago I work in an electronics factory and we did wire bonding Chip on Board modules, or COB as we call them. Bond wires where sealed with an special epoxy that had no thermal movement. Brand was Hysol then, now owned by Henkel, here is the link to what they have for that application now: https://www.henkel-adhesives.com/us/en/products/potting-encapsulating-injection-molding-compounds/glob-top-material.html And be careful, this not removable. Alternately, google for Glob Top Adhesive-Sealants.